芯       片：
平膜/隔膜感壓防堵結構設計，適用于熔體/流體介質；
采用進口感壓芯片；選進的貼片工藝；
高阻抗、高精度、高穩定性；
膜片結構：厚膜型壓阻式、溥膜型硅芯片、法蘭型大膜片；
100萬次使用壽命以上；

信號處理及輸出：
24位ADC采樣處理芯片；
DSP數字信號調理算法；
多點性線溫度校準；
電壓電流過載保護；
標準工業信號輸出：4-20mA(二線制)，0-20mA(三線制)，0-5VDC，0-10VDC，0.5-4.5VDC(三線制);
數字通訊信號輸出：RS485-RTU、超低功耗RS485-RTU
采用的32bit微處理器和24bit ADC
傳輸協議采用通用的MODBUS-RTU協議
支持波特率：1200~57600bps，校驗位：NONE、ODD、EVEN
支持用戶二次校準、清零、反清零、恢復出廠等操作
支持11種單位切換，支持浮點型、整型、百分比、格式化輸出
采集間隔0~43200秒(12小時)可設，既可連續采集，滿足高速采集的場合，也可單次觸發采集，限度降低功耗

結       構：
厚膜結構：深度氬弧焊接，連接彈性材料與過程接頭，強度高，抗沖擊，耐疲勞；
溥膜結構：激光焊接，連接彈性材料與過程接頭，硅油介質傳遞壓力，響應快，耐疲勞，小量程；
工業級2088鑄鋁合金防爆殼體，強度可靠堅固；
整體結構小巧，過程連接方式多樣化（M20X1.5,G1/2 ,ZG1/2,1/2NPT(螺紋小徑≥17mm)DN50等）；
過程連接材料：304或316；

應      用：
熔體/流體/粘稠性介質壓力測量與控制；
工業/電力/石油/自動化等領域的設備壓力測量


Chip:
Flat film / diaphragm pressure sensing and anti blocking structure design, suitable for melt / fluid medium;
Adopt imported pressure sensitive chip; select the chip technology;
High impedance, high precision and high stability;
Diaphragm structure: thick film piezoresistive, thin film silicon chip, flange type large diaphragm;
More than 1 million service life;

Signal processing and output:
24 bit ADC sampling processing chip;
DSP digital signal conditioning algorithm;
Multipoint line temperature calibration;
Voltage and current overload protection;
Standard industrial signal output: 4-20mA (two-wire system), 0-20mA (three wire system), 0-5vdc, 0-10vdc, 0.5-4.5vdc (three wire system);
Digital communication signal output: rs485-rtu, ultra-low power rs485-rtu
Advanced 32bit microprocessor and 24bit ADC
The transmission protocol adopts the general MODBUS-RTU protocol
Support baud rate: 1200 ~ 57600bps, check bit: , odd, even
It supports the user's secondary calibration, clearing, anti clearing, factory restoration and other operations
Supports 11 unit switches, floating point, integer, percentage, format output
The acquisition interval of 0-43200 seconds (12 hours) can be set, which can not only continuously acquire, but also meet the occasion of high-speed acquisition, and

can trigger acquisition once, minimizing power consumption

Structure:
Thick film structure: deep argon arc welding, connecting elastic material and process joint, high strength, impact resistance, fatigue resistance;
Thin film structure: laser welding, connecting elastic materials and process joints, silicon oil medium transfer pressure, fast response, fatigue resistance, small

range;
Industrial grade 2088 cast aluminum alloy explosion-proof shell, reliable and solid strength;
The overall structure is small and the process connection mode is diversified (m20x1.5, G1 / 2, ZG1 / 2, 1 / 2NPT (thread diameter ≥ 17mm) DN50, etc.);
Process connection material: 304 or 316;

Application:
Melt / fluid / viscous medium pressure measurement and control;
Equipment pressure measurement in industry / power / oil / automation and other fields